System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...
SimForm has been a game-changer in injection molding, offering users the ability to quickly & easily predict temperatures, optimize cooling channel placement, and improve the quality of molded parts ...
A study conducted jointly by ORNL and IACMI attempted to 3D print developmental tooling to compression mold sheet molding compound (SMC) using high-temperature carbon fiber-reinforced thermoplastics ...
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