Swiss-based manufacturer of electronics and sensors, TE Connectivity Ltd. TEL announced that its LGA (land grid array) 3647 Socket would be used in.

SINGAPORE — ST Assembly Test Services Ltd. has expanded its portfolio of solutions for wireless applications with the addition of Land Grid Array (LGA). The LGA is a laminate substrate-based, fine ...

Yesterday, a report emerged claiming that Intel is planning to release its upcoming 14-nanometer Broadwell architecture processors as a ball grid array (BGA) rather than an land grid array (LGA ...

Land Grid Array (LGA) capacitors from AVX have achieved the equivalent high frequency performance of complex 8-terminal Inter-Digitated Capacitors (IDC) in a two terminal device, said the supplier.

For the past eight years, Intel has used an LGA (land grid array) socket in which the actual contacts are on the motherboard with contact points on the CPU.

Land Grid Array capacitors from AVX have achieved, thanks to patented design innovations, the equivalent high-frequency performance of complex 8-terminal Inter- Digitated Capacitors in a simple ...

Swiss-based manufacturer of electronics and sensors, TE Connectivity Ltd. TEL announced that its LGA (land grid array) 3647 Socket would be used in Intel Corporation’s INTC new processors per ...

Swiss-based manufacturer of electronics and sensors, TE Connectivity Ltd. TEL announced that its LGA (land grid array) 3647 Socket would be used in Intel Corporation’s INTC new processors per ...

Swiss-based manufacturer of electronics and sensors, TE Connectivity Ltd. TEL announced that its LGA (land grid array) 3647 Socket would be used in Intel Corporation’s INTC new processors per ...