The new chips will ship in the yet-to-be-announced next-generation IBM Z. Three years ago, IBM announced Telum, a mainframe processor with an onboard AI accelerator shared across the eight cores.

IBM details its upcoming Telum II mainframe chip as well as its Sprye AI accelerator card. Both chips will be available in new mainframe systems next year. IBM should see a revenue boost from ...

IBM is promising quite a boost in overall compute performance when its next-generation mainframe launches later in the year. The new Telum chip, which is built on Samsung Foundry’s most advanced ...

IBM is outfitting the next generation of its Z and LinuxONE mainframes with its latest Telum processor and a new accelerator aimed at boosting performance of AI and other data-intensive workloads.

The new technologies are designed to significantly scale processing capacity across next generation IBM Z mainframe systems helping accelerate the use of traditional AI models and Large Language ...

IBM has revealed the specifications for its upcoming Telum II Processor and Spyre Accelerator, designed for better processing ...

Kyndryl survey suggests there's life in big iron yet Even mainframes can't escape the AI bug, with a report finding that big ...

IBM tends to launch a new generation of mainframe system every two or three years, and the next launch should be right around the corner. At the Hot Chips 2024 conference, the company laid out ...

New IBM Telum II Processor and IBM Spyre Accelerator unlock capabilities for enterprise-scale AI, including large language models and generative AI Skip to main content You have permission to edit ...

New IBM Telum II Processor and IBM Spyre Accelerator ... to support AI model workloads across the mainframe while designed to consume no more than 75W per card. Each chip will have 32 compute ...

1 Many IBM clients indicate architectural decisions ... AI-driven use cases designed to unlock business value and create new competitive advantages. With ensemble methods of AI, clients can ...