Die bonders are specialized semi- or fully-automatic high-precision machine tools used in semiconductor device fabrications. Die bonders fix the semiconductor chip, or die, to the substrate, package, ...

The die bonder equipment market is estimated to be worth US$ 4,415.3 million in 2023 and is set to surpass US$ 6,726.7 ...

Advanced packaging is currently facing a critical challenge to increase manufacturing efficiency without sacrificing device performance. Vertical integration techniques, such as multi-tier die ...

Computer aided manufacturing (CAM) is used to fabricate products directly from CAD outputs. Tool and die makers who provide design assistance can help with concepts, manufacturing costs, manufacturing ...