Use This Apple Engineer’s 7-Step Process to Solve Any Tough Problem

Expert software and systems engineer Allan Sun shares the system he developed for tackling obstacles big and small.

Diamond Certified Resource Unveils Comprehensive Winter 2025-2026 Guide for Consumers

Your Seasonal Guide to Winter-Related Services features articles, tips, photos, infographics and more.

I’ve Given 3 TEDx Talks — Here’s Exactly How to Prepare for Yours

After three talks, I've distilled the process into the key steps every speaker should follow to get ready for the stage.
IEEE

High-Density Embedded 3-D Stackable Via RRAM in 16-nm FinFET CMOS Logic Process

Abstract: This study introduces a breakthrough achievement of 0.1-Gb/mm2 wing-shaped high-density embedded 3-D via resistive random access memory (Via RRAM) in TSMC’s 16-nm FinFET CMOS logic process.

Doc who spent over 3 decades uniting the mentally ill with family

Dr. Bharat Vatwani and his wife rescue and reunite mentally ill homeless individuals with families, promoting mental health ...