In this article, a new thermal analysis method based on fluid-structure coupling and distributed convective heat transfer coefficient is proposed.

In this paper, a heat conduction structure (HCS) is designed to conduct the concentrated heat on the etched wafer in the etching process of MEMS devices with support anchors. During the reactive ion ...

Although a variety of methods to predict the effective thermal conductivity of porous foams have been proposed, the response of such materials under dynamic compressive loading has generally not been ...