NVIDIA's demand for advanced packaging from TSMC, but the tech it needs is changing: Jensen Huang says NVIDIA will transition ...

TSMC is on track to qualify its ultra-large version of chip-on-wafer-on-substrate (CoWoS) packaging technology that will offer an interposer size of up to nine reticle sizes and 12 HBM4 memory ...

Nvidia is moving the production of its Blackwell chips from TSMC's CoWoS-S to CoWoS-L advanced packaging technology.

Nvidia's (NASDAQ:NVDA) latest Blackwell lineup suggests it will reduce demand for CoWoS-S from Taiwan Semiconductor Manufacturing Company (NYSE:TSM) for at least the next year based on design ...

During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system ...

Speaking on the sidelines of an event hosted by chip supplier Siliconware Precision Industries in Taichung, Taiwan, Huang explained the transition in Nvidia's chip packaging requirements.

Nvidia's demand for advanced packaging from Taiwan Semiconductor remains strong despite evolving technology; plans to use CoWoS-L for Blackwell chip.

TSMC's CoWoS capacity expansion is expected to double again in 2025; commentary on plant progress would be a key focus point in Q4 FY24's earnings call. The next couple of quarters may see further ...

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief ...

Nvidia's most advanced artificial intelligence (AI) chip, Blackwell, consists of multiple chips glued together using a ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP).

Nvidia CEO Jensen Huang confirms changes in advanced packaging needs at TSMC, opting for CoWoS-L over CoWoS-S for upcoming Blackwell chip.