The U.S. Department of Energy will contribute $179 million for three new Microelectronics Science Research Centers, which will focus on research into solutions that bridge sensing, edge processing, AI ...

Recent Advances in Processing-in-DRAM” was published by researchers at ETH Zurich. Abstract “Memory-centric computing aims to ...

Carmakers and traditional tiered automotive suppliers are still grappling with how and when to move to software-first vehicle ...

A new technical paper titled “Multifunctional 2D FETs exploiting incipient ferroelectricity in freestanding SrTiO3 ...

Fab tools are being fine-tuned for through-silicon via processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in 3D packaging.

In 2024, hot topics included challenges involving chiplets and heterogeneous integration, AI, data management, MCUs, power semis, software-defined vehicles, sensors, adaptive test, yield tracking, ...